ICP - IC PACKAGING TECHNOLOGY EXPO 2009

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Description
Exhibition Featuring all Kinds of Machinery, Parts and Materials for IC Packaging
Where and When
Location: Tokyo International Exhibition Center (Tokyo Big Sight)
3-21-1 Ariake
Tokyo 135-0063
Japan
Map: Google | Yahoo | Mapquest
Date: Jan 28-30, 2009

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More Details
Categories: Industry   Electronics  
Subcategories: Power electronics   Logistics - Transport - Packaging  
Web Site: http://www.icp-expo.jp/en/
Producer/Organizer: Reed Exhibitions Japan

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